RF filters employing surface or bulk acoustic wave (SAW/BAW0 have been mass produced and widely used in modern mobile communication equipment. Nowadays various analog functions are going to be merged into the baseband chip, and current concern is how you integrate remaining one, namely the RF front end. This is not a simple task because major RF Functional devices are based on non-Si technologies, and the RF section becomes complex rapidly for supporting multi-band and multi mode operation.
This talk discusses research trends of the SAW/BAW filters, focusing on possible integration into RF ICs.
First, modern SAW/BAW technologies are introduced, and it is shown hoe high performances are achievable by the use of current state-of-the-art technologies. Secondly, current front end modules are surveyed, and then it is discussed how they are going to be integrated with active circuit elements.
Finally, System-in-Package (SiP) and System-on-Chip (SoC) technologies are discussed as a possible solution for the full integration of the RF front end including SAW/BAW devices into RF ICs.